Researcher

This research focuses on zirconium vanadate (ZrV₂O₇)-based negative thermal expansion materials and their application as functional fillers in electronic packaging underfill. Due to the large coefficient of thermal expansion (CTE) mismatch among silicon chips, substrates, copper micro-bumps, and epoxy underfill, advanced packaging structures often suffer from thermal stress accumulation and warpage during thermal processing or device operation. By incorporating ZrV₂O₇ into the underfill system, this study aims to tailor the overall thermal expansion behavior of the composite material, reduce CTE mismatch, suppress package warpage, and improve the thermomechanical reliability of advanced electronic packaging.

This research focuses on zirconium vanadate (ZrV₂O₇)-based negative thermal expansion materials and their application as functional fillers in electronic packaging underfill. Due to the large coefficient of thermal expansion (CTE) mismatch among silicon chips, substrates, copper micro-bumps, and epoxy underfill, advanced packaging structures often suffer from thermal stress accumulation and warpage during thermal processing or device operation. By incorporating ZrV₂O₇ into the underfill system, this study aims to tailor the overall thermal expansion behavior of the composite material, reduce CTE mismatch, suppress package warpage, and improve the thermomechanical reliability of advanced electronic packaging.

Electroless copper plating is a chemical metallization process that deposits copper onto a substrate through an autocatalytic redox reaction without applying external current. Copper ions are reduced on catalytic sites, forming a continuous copper layer on the substrate surface.

Electroless copper plating is a chemical metallization process that deposits copper onto a substrate through an autocatalytic redox reaction without applying external current. Copper ions are reduced on catalytic sites, forming a continuous copper layer on the substrate surface.