Research

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3D Packaging & Heterogeneous Integration

Plasma-Power-Controlled Ar/N₂ Activation for Electroless Cu Deposition and Seed-Layer Adhesion on Heterogeneous Substrates.
Our addresses the challenges of heterogeneous integration in advanced packaging by employing plasma-assisted surface modification to tune the interface energy of various substrates (e.g., SiO₂, SiC, Si).
Enhance film density and adhesion strength while investigating the evolution mechanisms of Cu–Cu bonding interfaces on Heterogeneous Integration.

High-Reliability Packaging Materials and Thermal Stress Management

To mitigate package warpage and thermal fatigue, this research utilizes the non-hydrolytic sol–gel (NHSG) method to develop negative thermal expansion (NTE) materials, specifically Ti-doped ZrV₂O₇.
By optimizing the integration of NTE fillers into epoxy composites.
Our research enables precise thermal stress compensation within the package, providing low-warpage and high-durability structural solutions for next-generation high-power devices.

Molecular Electronics and Intelligent Sensing Interfaces for Smart Packaging

Combining molecular chemistry with device physics, this research develops metal-organic framework (MOF) based ion-gated transistors (IGFETs).
By manipulating the thin-film states of functional molecules like Mn-TCPP, we achieve high-sensitivity monitoring of internal stress, thermal history, and chemical signals (e.g., H₂O₂).
We establishes engineering pathways for MOF-based electronics, providing a high-performance, self-diagnostic sensing platform for future smart packaging and biomedical applications.